| 类型 | 硬质板 | 测试程序 | ||
| HP5 | HP5 | |||
| 云母 | 白云母 | 金云母 | ||
| 云母含量% | 90 | 90 | IEC371 | |
| 胶含量% | 10 | 10 | IEC371 | |
| 密度 g/cm3 | 1.8~2.15* | 1.8~2.15* | IEC371 | |
| 耐温性能 | 连续耐温 ℃ | 550 | 800 | |
| 间歇耐温℃ | 800 | 1000 | ||
| 抗弯强度N/mm2 | >200 | >150 | GB/T5019 | |
| 吸水率 % | <0.5 | <0.5 | GB/T5019 | |
| 介电强度KV/mm | >20 | >20 | IEC243 | |
| 抗电阻性能 | 23℃ ohm.cm | >1017 | >1017 | IEC93 |
| 500℃ ohm.cm | >1012 | >1012 | IEC93 | |
| 热失重 | at 500℃ % | <1 | <1 | IEC371 |
| at 700℃% | <2 | IEC371 | ||